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Електронний архів КНУТД
Browsing by Subject Moldex3D
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Showing results 1 to 2 of 2
Issue Date
Title
Author(s)
7-Nov-2024
The reliability in IC industry: using thermal cycling tests to predict thermal fatigue
Chung, Stan
2023
Using cloud computing to progress Moldex3D simulations
Lin, Seifer
