Please use this identifier to cite or link to this item: https://er.knutd.edu.ua/handle/123456789/17000
Title: Ti-Si-C in-situ composite as a potencial material for lightweight SOFC interconnects
Other Titles: Ti-Si-C in-situ композит як потенційний матеріал для з’єднувальних елементів облегшених ТОПК
Authors: Podhurska, V.
Brodnikovskyi, D.
Vasyliv, B.
Gadzyra, M.
Tkachenko, S.
Čelko, L.
Ostash, O.
Brodnikovska, I.
Brodnikovskyi, Ye.
Vasylyev, O.
Issue Date: 2020
Citation: Ti-Si-C in-situ composite as a potencial material for lightweight SOFC interconnects = Ti-Si-C in-situ композит як потенційний матеріал для з’єднувальних елементів облегшених ТОПК [Текст] / V. Podhurska, D. Brodnikovskyi, B. Vasyliv, M. Gadzyra, S. Tkachenko, L. Čelko, O. Ostash, I. Brodnikovska, Ye. Brodnikovskyi, O. Vasylyev // Promising materials and processes in applied electrochemistry – 2020 : monograph / ed.: V. Z. Barsukov, Yu. V. Borysenko, V. G. Khomenko, O. V. Linyucheva ; editor-in-chief V. Z. Barsukov. - Kyiv : KNUTD, 2020. - С. 54-68.
Source: Promising materials and processes in applied electrochemistry – 2020
URI: https://er.knutd.edu.ua/handle/123456789/17000
Appears in Collections:Наукові публікації (статті)

Files in This Item:
File Description SizeFormat 
Promising_2020_P054-068.pdf2,88 MBAdobe PDFView/Open


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.